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Novel 3D heterogeneous integration for future miniaturized power RF Transceiver front ends

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The project “Novel 3D heterogeneous integration for future miniaturized power RF Transceiver frontends” (POWERPACK) proposes to develop disruptive technologies for RF MEMS for high frequency and high-power operation

Goal
The project will develop disruptive technologies for miniaturised RFchips for high frequency and high-power operation, and will focus on miniaturisation and 3D integration. The outcome will be a reduction in transmission losses, and will result in two demonstrators. These demonstrators will operate in the X-Band and in the Ka-Band. The devices will allow for integration in platforms where the components will need to ever be smaller and lighter.

Lead Partner
THALES
Partners involved
TAIPRO ENGINEERING SA, CIDETE INGENIEROS SOCIEDAD LIMITADA, CIRCUITS INTEGRATED HELLAS IKE, BERLINER NANOTEST UND DESIGN GMBH, MICROWAVE CHARACTERIZATION CENTER, IDRYMA TECHNOLOGIAS KAI EREVNAS, INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE, FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV, ARISTOTELIO PANEPISTIMIO THESSALONIKIS

Duration
01 December 2022 – 30 November 2025

Funding
€ 3,494,531.61 (European Defence Fund)

More information
https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/projects-details/44181033/101102564/EDF
https://defence-industry-space.ec.europa.eu/system/files/2022-07/Factsheet_EDF21_POWERPACK.pdf

The European Commission’s support for the production of this publication does not constitute an endorsement of the contents, which reflect the views only of the authors, and the Commission cannot be held responsible for any use which may be made of the information contained therein.

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