HIDRA – High Instantaneous Dynamic Range Direct RF sampling modular chiplet Architecture

Description
The project “High Instantaneous Dynamic Range Direct RF sampling modular chiplet Architecture” (HIDRA) offers to execute studies and design regarding Digital Signal Processing for Software Defined Radio.

Goal
The project will result in a modular chiplet architecture with carefully co-designed components leveraging best IC technologies for specific parts of the RF signal chain comprising direct RF sampling chiplet and high RF power handling chiplet. The project provides a viable path towards addressing one of the European technology shortfalls in the key area of semiconductor data converters for defense applications. It will strengthen the security of supply and contribute to European non-dependence by leveraging strength of current European leadership in advanced node FD SOI fabrication processes coupled with European GaN on SiC capabilities and know-how.

Lead Partner
BEYOND SEMICONDUCTOR, RAZISKAVE IN RAZVOJ, D.O.O.

Partners involved
BALTIJOS PAZANGIU TECHNOLOGIJU INSTITUTAS, UNIVERZA V LJUBLJANI, UNIVERSITE DE BORDEAUX, CONTINIUM TECHNOLOGIES S.R.O., ADVICO MICROELECTRONICS GMBH

Duration
01 December 2022 – 31 July 2026

Funding
€ 3,996,992.42

More information
https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/projects-details/44181033/101103423/EDF
https://defence-industry-space.ec.europa.eu/system/files/2022-09/Factsheet_EDF21_HIDRA.pdf